KUALA LUMPUR (July 17): NexG Bhd (KL:NEXG), formerly known as Datasonic Group Bhd, has secured a six-month contract extension from the Ministry of Home Affairs (KDN) to continue supplying passport chips to the Immigration Department. 

In a filing with Bursa Malaysia on Thursday, the company said its wholly owned subsidiary Datasonic Technologies Sdn Bhd (DTSB) had received and accepted the letter of extension dated July 2, marking the fifth extension for the passport chip supply contract.

The contract was first awarded to DTSB by KDN in December 2015 with an initial value of RM318.75 million over five years, from 2016 to 2021, for a total of 12.5 million chips.

The contract will now run from Dec 1, 2025, to May 31, 2026, on a month-to-month basis.

NexG did not disclose the value of the extension but confirmed that there are no changes to the contract’s ceiling value, item value or quantity. The company is required to furnish a new performance bond amounting to RM3.43 million, valid until May 31, 2027.

NexG said the contract is expected to contribute positively to its earnings and net assets per share for the financial year ending March 31, 2026, and beyond.

Earlier this month, NexG announced that it had also secured six-month extensions effective Dec 1, 2025, for its contracts to supply Malaysian passport documents and polycarbonate biodata pages.

Shares in NexG ended half a sen or 1.03% higher at 49 sen on Thursday, valuing the company at RM1.52 billion. Year to date, the counter has risen 75%. 

Read also:
NexG bags contract extensions from Home Ministry for maintenance, raw IC and passport supply jobs