KUALA LUMPUR (July 25): Pentamaster Corp Bhd (KL:PENTA) is positioning itself for the next phase of the artificial intelligence (AI)-driven semiconductor investment cycle with a new family of advanced packaging equipment that management believes could propel the group to record earnings by 2027.

The Penang-based automation specialist has spent the past two years developing its Samurai Series — a suite of machines spanning wafer inspection, chiplet testing, silicon photonics testing and system-level testing for advanced semiconductor packaging, one of the fastest-growing segments of the global chip industry.

Group executive chairman Datuk Chuah Choon Bin says four demonstration systems have already been deployed at customers in Taiwan, Europe and Malaysia, with the first commercial deliveries expected by the end of this year before a broader production ramp in 2027.

The company is also participating in the Malaysia Advanced Packaging Consortium, a government-backed initiative aimed at building domestic capabilities in advanced semiconductor packaging. Chuah believes the programme offers Malaysia a rare opportunity to move into a higher-value segment of the semiconductor supply chain while manufacturing standards are still evolving.

Despite investing about RM300 million of internally generated cash to expand its manufacturing footprint over the past two years, Pentamaster remains debt-free and expects to resume dividend payments next year as earnings recover.

This week's cover story examines Pentamaster's growth strategy, its AI-powered manufacturing platform, expansion into humanoid robotics, the risks facing its ambitious plans, and why analysts remain divided over the stock's valuation.

To find out more about Pentamaster’s prospects, grab a copy of The Edge Malaysia weekly today to read our exclusive interview with Chuah.

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