KUALA LUMPUR (Sept 12): X-FAB, a Germany-based mixed-signal and specialty semiconductor manufacturer, on Friday announced a RM3 billion expansion of its Sarawak facility.
The new line, focusing on chips for automotive, medical and industrial applications, will raise X-FAB Sarawak's monthly wafer production capacity to 40,000 units from 30,000 units. The facility is already operational and will supply customers across automotive, industrial and medical sectors.
The expansion also more than doubles the site’s capacity for its 180-nanometre mixed signal chips, used in applications such as ultrasound systems and electric vehicle power semiconductors, said X-FAB Group chief executive officer Rudi De Winter.
“I am grateful for the continued support from the Malaysian Investment Development Authority (Mida) and the Sarawak government, enabling us to achieve this major milestone for the future success of the entire X-FAB group,” he said in a statement.
The facility was jointly inaugurated by Prime Minister Datuk Seri Anwar Ibrahim and Sarawak Premier Tan Sri Abang Johari Tun Openg.
Investment, Trade and Industry Minister Tengku Datuk Seri Zafrul Abdul Aziz said the expansion reflects investor confidence in Malaysia’s long-term industrial reforms and supports the country’s ambition to become a hub for advanced manufacturing.
Both the ministry and Mida are “focused on attracting quality investments that create jobs and build key tech skills for Malaysians, to further drive innovation in our industries”, he said.
Mida chief executive Datuk Sikh Shamsul Ibrahim, meanwhile, said the investment will have spillover benefits for local communities by creating high-value jobs, nurturing skilled talent, and empowering local businesses.